Our thin film structures are used in a wide range of fields including oil and gas exploration, aerospace and medical applications.

We manufacture customer-specific and standard products in thin film technology:

• Highly integrated thin film interconnection
• Interconnection structures combined with flip-chip and chip & wire pads on one substrate
• Substrate bumping for flip-chip-technology
• Integrated thin film resistors
• Precise HF-structures
• Substrate through hole technology
• High line & space resolution
• RoHS-compliant

If you need further technical advise or assistance please contact us. Our development department is looking forward to new challenges!